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Xin Li
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Pressureless sintering of nanosilver paste at low temperature to join large area (≥ 100 mm2) power chips for electronic packaging
S Fu, Y Mei, GQ Lu, X Li, G Chen, X Chen
Materials Letters 128, 42-45, 2014
1202014
Nickel Cobalt Sulfide core/shell structure on 3D Graphene for supercapacitor application
LG Beka, X Li, W Liu
Scientific reports 7 (1), 2105, 2017
1192017
A novel multiscale silver paste for die bonding on bare copper by low-temperature pressure-free sintering in air
J Li, X Li, L Wang, YH Mei, GQ Lu
Materials & Design 140, 64-72, 2018
742018
Creep properties of low-temperature sintered nano-silver lap shear joints
X Li, G Chen, L Wang, YH Mei, X Chen, GQ Lu
Materials Science and Engineering: A 579, 108-113, 2013
742013
Applying viscoplastic constitutive models to predict ratcheting behavior of sintered nanosilver lap-shear joint
G Chen, ZS Zhang, YH Mei, X Li, DJ Yu, L Wang, X Chen
Mechanics of Materials 72, 61-71, 2014
672014
Study on high temperature bonding reliability of sintered nano-silver joint on bare copper plate
SY Zhao, X Li, YH Mei, GQ Lu
Microelectronics Reliability 55 (12), 2524-2531, 2015
602015
Correlation between interfacial microstructure and bonding strength of sintered nanosilver on ENIG and electroplated Ni/Au direct-bond-copper (DBC) substrates
Q Xu, Y Mei, X Li, GQ Lu
Journal of Alloys and Compounds 675, 317-324, 2016
592016
Simplification of low-temperature sintering nanosilver for power electronics packaging
Y Mei, G Chen, Y Cao, X Li, D Han, X Chen
Journal of electronic materials 42, 1209-1218, 2013
582013
Temperature Dependence of Dynamic Performance Characterization of 1.2-kV SiC Power mosfets Compared With Si IGBTs for Wide Temperature Applications
J Qi, X Yang, X Li, K Tian, Z Mao, S Yang, W Song
IEEE Transactions on Power Electronics 34 (9), 9105-9117, 2018
572018
Reliability evaluation of multichip phase-leg IGBT modules using pressureless sintering of nanosilver paste by power cycling tests
S Fu, Y Mei, X Li, C Ma, GQ Lu
IEEE Transactions on Power Electronics 32 (8), 6049-6058, 2016
492016
Granular activated carbon supported iron as a heterogeneous persulfate catalyst for the pretreatment of mature landfill leachate
Z Li, Q Yang, Y Zhong, X Li, L Zhou, X Li, G Zeng
RSC advances 6 (2), 987-994, 2016
492016
Fatigue and dwell-fatigue behavior of nano-silver sintered lap-shear joint at elevated temperature
Y Tan, X Li, X Chen
Microelectronics Reliability 54 (3), 648-653, 2014
462014
Reliability improvement of a double-sided IGBT module by lowering stress gradient using molybdenum buffers
M Wang, Y Mei, W Liu, Y Xie, S Fu, X Li, GQ Lu
IEEE Journal of Emerging and Selected Topics in Power Electronics 7 (3 …, 2019
442019
Pressureless sintering of nanosilver paste as die attachment on substrates with ENIG finish for semiconductor applications
X Wang, Y Mei, X Li, M Wang, Z Cui, GQ Lu
Journal of Alloys and Compounds 777, 578-585, 2019
442019
Rapid sintering nanosilver joint by pulse current for power electronics packaging
Y Mei, Y Cao, G Chen, X Li, GQ Lu, X Chen
IEEE Transactions on Device and Materials Reliability 13 (1), 258-265, 2013
442013
Rapid sintering of nano-Ag paste at low current to bond large area (> 100 mm2) power chips for electronics packaging
Y Xie, Y Wang, Y Mei, H Xie, K Zhang, S Feng, KS Siow, X Li, GQ Lu
Journal of Materials Processing Technology 255, 644-649, 2018
432018
Parametric Study on Pressureless Sintering of Nanosilver Paste to Bond Large-Area (≥100 mm2) Power Chips at Low Temperatures for Electronic Packaging
S Fu, Y Mei, X Li, P Ning, GQ Lu
Journal of Electronic Materials 44, 3973-3984, 2015
432015
Mechanical property evaluation of nano‐silver paste sintered joint using lap‐shear test
X Li, G Chen, X Chen, GQ Lu, L Wang, YH Mei
Soldering & surface mount technology 24 (2), 120-126, 2012
402012
High temperature ratcheting behavior of nano-silver paste sintered lap shear joint under cyclic shear force
X Li, G Chen, X Chen, GQ Lu, L Wang, YH Mei
Microelectronics Reliability 53 (1), 174-181, 2013
392013
Reliability comparison between SAC305 joint and sintered nanosilver joint at high temperatures for power electronic packaging
G Chen, L Yu, YH Mei, X Li, X Chen, GQ Lu
Journal of Materials Processing Technology 214 (9), 1900-1908, 2014
382014
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