Mechanical properties of Sn–0.7 Cu/Si3N4 lead-free composite solder MAAM Salleh, AMM Al Bakri, MH Zan, F Somidin, NFM Alui, ZA Ahmad
Materials Science and Engineering: A 556, 633-637, 2012
74 2012 Solderability of Sn-0.7 Cu/Si3N4 lead-free composite solder on Cu-substrate MS MAA, AMM Al Bakri, H Kamarudin, M Bnhussain, F Somidin
Physics Procedia 22, 299-304, 2011
61 2011 Characterising the polymorphic phase transformation at a localised point on a Cu6Sn5 grain F Somidin, H Maeno, MAAM Salleh, XQ Tran, SD McDonald, ...
Materials Characterization 138, 113-119, 2018
40 2018 In -Situ Observation of the Continuous Phase Transition in Determining the High Thermoelectric Performance of Polycrystalline Sn0.98 SeM Dargusch, XL Shi, XQ Tran, T Feng, F Somidin, X Tan, W Liu, K Jack, ...
The Journal of Physical Chemistry Letters 10 (21), 6512-6517, 2019
39 2019 A comparative study of solder properties of Sn-0.7 Cu lead-free solder fabricated via the powder metallurgy and casting methods M Salleh, AMM Al Bakri, F Somidin, AV Sandu, N Saud, H Kamaruddin, ...
Revista de Chimie (Bucharest) 64 (7), 2013
23 2013 Atom locations in a Ni doped η-(Cu, Ni) 6Sn5 intermetallic compound W Yang, T Yamamoto, K Aso, F Somidin, K Nogita, S Matsumura
Scripta Materialia 158, 1-5, 2019
22 2019 Intermetallic compound formation on solder alloy/Cu-substrate interface using lead-free Sn-0.7 Cu/recycled-Aluminum composite solder F Somidin, MAA Mohd Salleh, KR Ahmad
Advanced Materials Research 620, 105-111, 2013
21 2013 Imaging the Polymorphic Transformation in a Single Cu6 Sn5 Grain in a Solder Joint F Somidin, H Maeno, XQ Tran, S D. McDonald, MAA Mohd Salleh, ...
Materials 11 (11), 2229, 2018
15 2018 Atomic locations of minor dopants and their roles in the stabilization of W Yang, X Quy Tran, T Yamamoto, S Yoshioka, F Somidin, K Nogita, ...
Physical Review Materials 4 (6), 065002, 2020
11 2020 Origin of Primary Cu6 Sn5 in Hypoeutectic Solder Alloys and a Method of Suppression to Improve Mechanical Properties SFN Muhd Amli, MAA Mohd Salleh, MII Ramli, H Yasuda, J Chaiprapa, ...
Journal of Electronic Materials 50, 710-722, 2021
10 2021 Direct observation of the Ni stabilising effect in interfacial (Cu, Ni) 6Sn5 intermetallic compounds F Somidin, H Maeno, T Toriyama, SD McDonald, W Yang, S Matsumura, ...
Materialia 9, 100530, 2020
9 2020 Reducing cracking in solder joint interfacial Cu6Sn5 with modified reflow profile F Somidin, SD McDonald, X Ye, D Qu, K Sweatman, T Akaiwa, ...
Transactions of The Japan Institute of Electronics Packaging 13, E19-004-1 …, 2020
7 2020 The effectiveness of Ni microalloying on the microstructure and mechanical properties of low temperature In-35 wt% Sn/Cu solder joint MS Chang, MAAM Salleh, F Somidin, DSC Halin, H Yasuda, K Nogita
Materials Science and Engineering: A 882, 145457, 2023
6 2023 Recent development of novel lead-free composite solders using microwave-assisted sintering powder metallurgy route MAAM Salleh, AMM Al Bakri, F Somidin, H Kamarudin
International Review of Mechanical Engineering 7, 53-59, 2013
5 2013 In situ observation of liquid solder alloys and solid substrate reactions using high-voltage transmission electron microscopy XF Tan, F Somidin, SD McDonald, MJ Bermingham, H Maeno, ...
Materials 15 (2), 510, 2022
4 2022 In-situ observation of high-temperature Pb-free electric interconnections by synchrotron microradiography NRA Razak, XF Tan, F Somidin, H Yasuda, SD McDonald, K Nogita
Materials Letters 291, 129520, 2021
4 2021 Atomic insights into the ordered solid solutions of Ni and Au in η-Cu6Sn5 W Yang, XQ Tran, T Yamamoto, K Aso, F Somidin, XF Tan, Y Kawami, ...
Acta Materialia 224, 117513, 2022
3 2022 Mixed assembly of lead-free solder joint: a short review RM Said, MAAM Salleh, MII Ramli, N Saud, F Somidin, NRA Razak, ...
Journal of Physics: Conference Series 2169 (1), 012039, 2022
3 2022 Effect of reflow conditions on the intermetallic layer in solder joints K Nogita, F Somidin, MAAM Salleh, K Sweatman, T Nishimura, ...
2018 International Conference on Electronics Packaging and iMAPS All Asia …, 2018
3 2018 Formation of Kirkendall Voids at Low and High Aging Temperature in the Sn-0.7Cu-1.0wt.%Si3 N4 /Cu Solder Joints N Saud, F Somidin, NS Ibrahim, MAA Mohd Salleh
Advanced Materials Research 1107, 577-581, 2015
3 2015