Muhammad Nubli Zulkifli
Title
Cited by
Cited by
Year
Temperature cycling analysis for ball grid array package using finite element analysis
MN Zulkifli, ZAZ Jamal, GA Quadir
Microelectronics International, 2011
202011
Some thoughts on bondability and strength of gold wire bonding
MN Zulkifli, S Abdullah, NK Othman, A Jalar
Gold Bulletin 45 (3), 115-125, 2012
192012
Nanoindentation Test for the Strength Distrubution Analysis of Bonded Au Ball Bonds
A Jalar, MN Zulkifli, S Abdullah
Advanced Materials Research 148, 1163-1166, 2011
92011
Strength distribution of Au ball bond using nanoindentation approach
MN Zulkifli, A Jalar, S Abdullah, IA Rahman, MAA Hamid
Materials Science and Engineering: A 577, 189-196, 2013
82013
Deformation behaviour of Sn-3.0 Ag-0.5 Cu (SAC305) solder wire under varied tensile strain rates
I Abdullah, MN Zulkifli, A Jalar, R Ismail
Soldering & Surface Mount Technology, 2017
62017
Effect of applied load in the nanoindentation of gold ball bonds
MN Zulkifli, A Jalar, S Abdullah, IA Rahman, NK Othman
Journal of electronic materials 42 (6), 1063-1072, 2013
62013
Relationship of Mechanical and Micromechanical Properties with Microstructural Evolution of Sn-3.0 Ag-0.5 Cu (SAC305) Solder Wire Under Varied Tensile Strain Rates and Temperatures
I Abdullah, MN Zulkifli, A Jalar, R Ismail, MA Ambak
Journal of Electronic Materials 48 (5), 2826-2839, 2019
42019
Deformation behavior relationship between tensile and nanoindentation tests of SAC305 lead-free solder wire
I Abdullah, MN Zulkifli, A Jalar, R Ismail
Soldering & Surface Mount Technology, 2018
32018
The re-evaluation of mechanical properties of wire bonding
A Jalar, MN Zulkifli, NK Othman, S Abdullah
2011 International Symposium on Advanced Packaging Materials (APM), 226-233, 2011
32011
Bondability of Second Copper Wire Bonds on Silver and Nickel-Palladium–Gold-Silver Metallization
R Ismail, F Harun, MN Zulkifli, A Jalar, MA Bakar, S Abdullah
IEEE Transactions on Components, Packaging and Manufacturing Technology 5 …, 2015
22015
Finite element analysis on the thermoelectric generator for the waste heat recovery of solar application
MN Zulkifli, I Ilias, A Abas, WMW Muhamad
AIP Conference Proceedings 1877 (1), 080004, 2017
12017
Finite element analysis of thermoelectric generator with aluminum plate for waste heat recovery application
MN Zulkifli, I Ilias, A Abas, WMW Muhamad
International Journal on Advanced Science, Engineering and Information …, 2017
12017
Nanoindentation creep analysis of gold ball bond
MN Zulkifli, A Jalar, S Abdullah, NK Othman, MAA Hamid
2012 10th IEEE International Conference on Semiconductor Electronics (ICSE …, 2012
12012
Hardness variation of ball bond wire bonding
MN Zulkifli, A Jalar, S Abdullah, R Shamsudin
Advanced Materials Research 399, 1048-1051, 2012
12012
Effect of surface roughness and hardness of leadframe on the bondability of gold wedge bonds
MN Zulkifli, F Harun, A Jalar
Microelectronics International, 2019
2019
Effect of Conventional and Granular Capillaries Usage on the Bondability, Reliability, and Manufacturability of Gold Wedge Bonds
MN Zulkifli, A Jalar, F Harun
IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (4 …, 2019
2019
Rapid fabrication and characterization of PDMS microfluidics device using printed conductive silver ink
AA Aziz, MAM Azmi, MN Zulkifli, AN Nordin, AK Bahrain, FZ Makmon, ...
Materials Today: Proceedings 16, 1661-1667, 2019
2019
Bondability and Strength Evaluation of Gold Ball Bond Using Nanoindentation Approach
MN Zulkifli, A Jalar, S Abdullah, NK Othman
Key Engineering Materials 700, 132-141, 2016
2016
Effect of Nanoindentation Loading Rate on Gold Ball Bond
MN Zulkifli, A Jalar, S Abdullah
Materials Science Forum 756, 151-155, 2013
2013
Nanoindentation Stereometry of Wire Bonding
MN Zulkifli, A Jalar, S Abdullah, NK Othman
Advanced Science Letters 13 (1), 474-477, 2012
2012
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Articles 1–20