Yukihiro Shimogaki
Yukihiro Shimogaki
Professor of Materials Engineering, The University of Tokyo
Verified email at dpe.mm.t.u-tokyo.ac.jp
Title
Cited by
Cited by
Year
Cu wettability and diffusion barrier property of Ru thin film for Cu metallization
H Kim, T Koseki, T Ohba, T Ohta, Y Kojima, H Sato, Y Shimogaki
Journal of The Electrochemical Society 152 (8), G594, 2005
1462005
Preparation of low-dielectric-constant F-Doped SiO2 films by plasma-enhanced chemical vapor deposition
SW Lim, Y Shimogaki, Y Nakano, K Tada, H Komiyama
Japanese journal of applied physics 35 (2S), 1468, 1996
1081996
Chemical reaction engineering in the design of CVD reactors
H Komiyama, Y Shimogaki, Y Egashira
Chemical Engineering Science 54 (13-14), 1941-1957, 1999
941999
Surface reaction kinetics in metalorganic vapor phase epitaxy of GaAs through analyses of growth rate profile in wide-gap selective-area growth
H Oh, M Sugiyama, Y Nakano, Y Shimogaki
Japanese journal of applied physics 42 (10R), 6284, 2003
702003
Atomic layer deposited Co (W) film as a single-layered barrier/liner for next-generation Cu-interconnects
H Shimizu, K Sakoda, T Momose, Y Shimogaki
Japanese Journal of Applied Physics 51 (5S), 05EB02, 2012
612012
Shortest intersubband transition wavelength (1.68 μm) achieved in AlN/GaN multiple quantum wells by metalorganic vapor phase epitaxy
I Waki, C Kumtornkittikul, Y Shimogaki, Y Nakano
Applied physics letters 82 (25), 4465-4467, 2003
602003
Heat-resistant composite material production method and production device
T Nakamura, K Hotozuka, Y Fukushima, Y Shimogaki, T Momose, ...
US Patent 10,167,549, 2019
572019
Hot-wire-assisted atomic layer deposition of a high quality cobalt film using cobaltocene: Elementary reaction analysis on NHx radical formation
H Shimizu, K Sakoda, T Momose, M Koshi, Y Shimogaki
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 30 (1 …, 2012
572012
X-ray photoelectron spectroscopic characterization of the adhesion behavior of chemical vapor deposited copper films
YS Kim, Y Shimogaki
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 19 (5 …, 2001
552001
Reduction Mechanism in the Dielectric Constant of Fluorine‐Doped Silicon Dioxide Film
SW Lim, Y Shimogaki, Y Nakano, K Tada, H Komiyama
Journal of the Electrochemical Society 144 (7), 2531, 1997
551997
Kinetic studies on thermal decomposition of MOVPE sources using fourier transform infrared spectroscopy
M Sugiyama, K Kusunoki, Y Shimogaki, S Sudo, Y Nakano, H Nagamoto, ...
Applied surface science 117, 746-752, 1997
531997
Conformal deposition and gap-filling of copper into ultranarrow patterns by supercritical fluid deposition
T Momose, M Sugiyama, E Kondoh, Y Shimogaki
Applied physics express 1 (9), 097002, 2008
522008
Fundamental kinetics determining growth rate profiles of InP and GaAs in MOCVD with horizontal reactor
IT Im, HJ Oh, M Sugiyama, Y Nakano, Y Shimogaki
Journal of crystal growth 261 (2-3), 214-224, 2004
462004
Changes in orientational polarization and structure of silicon dioxide film by fluorine addition
SW Lim, Y Shimogaki, Y Nakano, K Tada, H Komiyama
Journal of the Electrochemical Society 146 (11), 4196, 1999
451999
Diffusion barrier property of TiN and TiN/Al/TiN films deposited with FMCVD for Cu interconnection in ULSI
YH Shin, Y Shimogaki
Science and Technology of Advanced Materials 5 (4), 399, 2004
442004
The Role of Gas‐Phase Reactions during Chemical Vapor Deposition of Copper from (hfac) Cu (tmvs)
YK Chae, Y Shimogaki, H Komiyama
Journal of The Electrochemical Society 145 (12), 4226, 1998
431998
Precursor evaluation for Cu-supercritical fluid deposition based on adhesion properties and surface morphology
T Momose, M Sugiyama, Y Shimogaki
Japanese journal of applied physics 44 (9L), L1199, 2005
392005
CVD of cobalt–tungsten alloy film as a novel copper diffusion barrier
H Shimizu, K Sakoda, Y Shimogaki
Microelectronic Engineering 106, 91-95, 2013
382013
Kinetics of deposition of Cu thin films in supercritical carbon dioxide solutions from a F-free copper (II) β-diketone complex
M Matsubara, M Hirose, K Tamai, Y Shimogaki, E Kondoh
Journal of the Electrochemical Society 156 (6), H443, 2009
382009
Macro/microcavity method and its application in modeling chemical vapor deposition reaction systems
LS Hong, Y Shimogaki, H Komjyama
Thin Solid Films 365 (2), 176-188, 2000
372000
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Articles 1–20