Fakhrozi Che Ani
Fakhrozi Che Ani
Institute of Microengineering and Nanoelectronics (IMEN), The National University of Malaysia/UKM
Verified email at jabil.com - Homepage
Title
Cited by
Cited by
Year
Three-dimensional numerical and experimental investigations on polymer rheology in meso-scale injection molding
CY Khor, ZM Ariff, FC Ani, MA Mujeebu, MK Abdullah, MZ Abdullah, ...
International Communications in Heat and Mass Transfer 37 (2), 131-139, 2010
612010
FVM based numerical study on the effect of solder bump arrangement on capillary driven flip chip underfill process
CY Khor, MZ Abdullah, MA Mujeebu, FC Ani
International Communications in Heat and Mass Transfer 37 (3), 281-286, 2010
382010
Study on the fluid/structure interaction at different inlet pressures in molded packaging
CY Khor, MZ Abdullah, FC Ani
Microelectronic Engineering 88 (10), 3182-3194, 2011
322011
Finite volume based CFD simulation of pressurized flip-chip underfill encapsulation process
CY Khor, MA Mujeebu, MZ Abdullah, FC Ani
Microelectronics Reliability 50 (1), 98-105, 2010
312010
Influence of pin offset in PCB through-hole during wave soldering process: CFD modeling approach
MSA Aziz, MZ Abdullah, CY Khor, FC Ani
International Communications in Heat and Mass Transfer 48, 116-123, 2013
292013
Lattice Boltzmann method study of bga bump arrangements on void formation
A Abas, MHH Ishak, MZ Abdullah, FC Ani, SF Khor
Microelectronics Reliability 56, 170-181, 2016
272016
CFD modeling of pin shape effects on capillary flow during wave soldering
MSA Aziz, MZ Abdullah, CY Khor, A Jalar, FC Ani
International Journal of Heat and Mass Transfer 72, 400-410, 2014
262014
Optimization modeling of the cooling stage of reflow soldering process for ball grid array package using the gray-based Taguchi method
CS Lau, MZ Abdullah, FC Ani
Microelectronics Reliability 52 (6), 1143-1152, 2012
262012
Three‐dimensional thermal investigations at board level in a reflow oven using thermal‐coupling method
CS Lau, MZ Abdullah, FC Ani
Soldering & Surface Mount Technology, 2012
252012
Computational fluid dynamic and thermal analysis for BGA assembly during forced convection reflow soldering process
CS Lau, MZ Abdullah, FC Ani
Soldering & surface mount technology, 2012
252012
Hardness profiles of Sn-3.0 Ag-0.5 Cu-TiO2 composite solder by nanoindentation
MZ Yahaya, FC Ani, Z Samsudin, S Sahin, MZ Abdullah, AA Mohamad
Materials Science and Engineering: A 669, 178-186, 2016
232016
Effect of ILU dispensing types for different solder bump arrangements on CUF encapsulation process
A Abas, MS Haslinda, MHH Ishak, AS Nurfatin, MZ Abdullah, FC Ani
Microelectronic Engineering 163, 83-97, 2016
192016
Numerical simulation of self-alignment of chip resistor components for different silver content during reflow soldering
AM Najib, MZ Abdullah, AA Saad, Z Samsudin, FC Ani
Microelectronics Reliability 79, 69-78, 2017
172017
Discrete phase method study of ball grid array underfill process using nano-silica filler-reinforced composite-encapsulant with varying filler loadings
FC Ng, A Abas, ZL Gan, MZ Abdullah, FC Ani, MYT Ali
Microelectronics Reliability 72, 45-64, 2017
172017
Effect of solder joint arrangements on BGA Lead-Free reliability during cooling stage of reflow soldering process
CS Lau, MZ Abdullah, FC Ani
IEEE Transactions on Components, Packaging and Manufacturing Technology 2 …, 2012
142012
SAC–xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly
FC Ani, A Jalar, AA Saad, CY Khor, R Ismail, Z Bachok, MA Abas, ...
Soldering & Surface Mount Technology, 2018
132018
Electrochemical migration behaviours of low silver content solder alloy SAC 0307 on printed circuit boards (PCBs) in NaCl solution
NK Othman, KY Teng, A Jalar, F Che Ani, Z Samsudin
Materials Science Forum 846, 3-12, 2016
92016
Underfill process for two parallel plates and flip chip packaging
CY Khor, MZ Abdullah, FC Ani
International communications in heat and mass transfer 39 (8), 1205-1212, 2012
92012
Influence of solder joint length to the mechanical aspect during the thermal stress analysis
JS Tan, CY Khor, WMFWA Rahim, MI Ishak, MU Rosli, MR Jamalludin, ...
AIP Conference Proceedings 1885 (1), 020063, 2017
82017
Reflow optimization process: thermal stress using numerical analysis and intermetallic spallation in backwards compatibility solder joints
FC Ani, A Jalar, R Ismail, NK Othman, MZ Abdullah, MSA Aziz, CY Khor, ...
Arabian Journal for Science and Engineering 40 (6), 1669-1679, 2015
62015
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