Follow
Fakhrozi Che Ani
Fakhrozi Che Ani
Institute of Microengineering and Nanoelectronics (IMEN), The National University of Malaysia/UKM
Verified email at jabil.com - Homepage
Title
Cited by
Cited by
Year
Three-dimensional numerical and experimental investigations on polymer rheology in meso-scale injection molding
CY Khor, ZM Ariff, FC Ani, MA Mujeebu, MK Abdullah, MZ Abdullah, ...
International Communications in Heat and Mass Transfer 37 (2), 131-139, 2010
722010
CFD modeling of pin shape effects on capillary flow during wave soldering
MSA Aziz, MZ Abdullah, CY Khor, A Jalar, FC Ani
International Journal of Heat and Mass Transfer 72, 400-410, 2014
552014
Computational fluid dynamic and thermal analysis for BGA assembly during forced convection reflow soldering process
CS Lau, MZ Abdullah, FC Ani
Soldering & surface mount technology 24 (2), 77-91, 2012
502012
Influence of pin offset in PCB through-hole during wave soldering process: CFD modeling approach
MSA Aziz, MZ Abdullah, CY Khor, FC Ani
International Communications in Heat and Mass Transfer 48, 116-123, 2013
482013
FVM based numerical study on the effect of solder bump arrangement on capillary driven flip chip underfill process
CY Khor, MZ Abdullah, MA Mujeebu, FC Ani
International Communications in Heat and Mass Transfer 37 (3), 281-286, 2010
482010
Lattice Boltzmann method study of bga bump arrangements on void formation
A Abas, MHH Ishak, MZ Abdullah, FC Ani, SF Khor
Microelectronics Reliability 56, 170-181, 2016
432016
Finite volume based CFD simulation of pressurized flip-chip underfill encapsulation process
CY Khor, MA Mujeebu, MZ Abdullah, FC Ani
Microelectronics Reliability 50 (1), 98-105, 2010
422010
Hardness profiles of Sn-3.0 Ag-0.5 Cu-TiO2 composite solder by nanoindentation
MZ Yahaya, FC Ani, Z Samsudin, S Sahin, MZ Abdullah, AA Mohamad
Materials Science and Engineering: A 669, 178-186, 2016
412016
Hydrophobicity performance of polyethylene terephthalate (PET) and thermoplastic polyurethane (TPU) with thermal effect
S Jasmee, G Omar, NAB Masripan, AA Kamarolzaman, AS Ashikin, ...
Materials research express 5 (9), 096304, 2018
402018
Three‐dimensional thermal investigations at board level in a reflow oven using thermal‐coupling method
CS Lau, MZ Abdullah, F Che Ani
Soldering & Surface Mount Technology 24 (3), 167-182, 2012
402012
Optimization modeling of the cooling stage of reflow soldering process for ball grid array package using the gray-based Taguchi method
CS Lau, MZ Abdullah, FC Ani
Microelectronics Reliability 52 (6), 1143-1152, 2012
382012
Numerical simulation of self-alignment of chip resistor components for different silver content during reflow soldering
AM Najib, MZ Abdullah, AA Saad, Z Samsudin, FC Ani
Microelectronics Reliability 79, 69-78, 2017
372017
Discrete phase method study of ball grid array underfill process using nano-silica filler-reinforced composite-encapsulant with varying filler loadings
FC Ng, A Abas, ZL Gan, MZ Abdullah, FC Ani, MYT Ali
Microelectronics Reliability 72, 45-64, 2017
362017
Study on the fluid/structure interaction at different inlet pressures in molded packaging
CY Khor, MZ Abdullah, FC Ani
Microelectronic Engineering 88 (10), 3182-3194, 2011
352011
SAC–xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly
F Che Ani, A Jalar, AA Saad, CY Khor, R Ismail, Z Bachok, MA Abas, ...
Soldering & Surface Mount Technology 30 (1), 1-13, 2018
332018
Effect of ILU dispensing types for different solder bump arrangements on CUF encapsulation process
A Abas, MS Haslinda, MHH Ishak, AS Nurfatin, MZ Abdullah, FC Ani
Microelectronic Engineering 163, 83-97, 2016
332016
Effect of solder joint arrangements on BGA lead-free reliability during cooling stage of reflow soldering process
CS Lau, MZ Abdullah, FC Ani
IEEE Transactions on Components, Packaging and Manufacturing Technology 2 …, 2012
222012
Characterization of SAC–x NiO nano-reinforced lead-free solder joint in an ultra-fine package assembly
F Che Ani, A Jalar, AA Saad, CY Khor, MA Abas, Z Bachok, NK Othman
Soldering & Surface Mount Technology 31 (2), 109-124, 2019
182019
The influence of Fe2O3 nano-reinforced SAC lead-free solder in the ultra-fine electronics assembly
F Che Ani, A Jalar, AA Saad, CY Khor, R Ismail, Z Bachok, MA Abas, ...
The International Journal of Advanced Manufacturing Technology 96, 717-733, 2018
182018
Underfill process for two parallel plates and flip chip packaging
CY Khor, MZ Abdullah, FC Ani
International communications in heat and mass transfer 39 (8), 1205-1212, 2012
162012
The system can't perform the operation now. Try again later.
Articles 1–20