‪I G. B. Budi Dharma‬ - ‪Google Scholar‬

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I G. B. Budi Dharma

I G. B. Budi Dharma

Gadjah Mada University

Verified email at ugm.ac.id

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Wettability of low silver content lead-free solder alloy IGBB Dharma, MH Abd Shukor, T Ariga Materials transactions 50 (5), 1135-1138, 2009	16	2009
The effects of adding silver and indium to lead-free solders IGBB DHARMA, M Hamdi, T Ariga Weld. J.(Miami, FL) 88 (4), 45-48, 2009	7	2009
Solderability of Sn-Cu-based Lead-free Solder with Low Content of Silver and Indium IGBB Dharma Jabatan Kejuruteraan Rekabentuk dan Pembuatan, Fakulti Kejuruteraan …, 2010		2010
Brazing of Pure Copper with BAg-8 Braze Alloy IGBB Dharma Jabatan Kejuruteraan Rekabentuk dan Pembuatan, Fakulti Kejuruteraan …, 2005		2005

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