I G. B. Budi Dharma
I G. B. Budi Dharma
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TitleCited byYear
Wettability of low silver content lead-free solder alloy
IGBB Dharma, MHA Shukor, T Ariga
Materials transactions 50 (5), 1135-1138, 2009
82009
The effects of adding silver and indium to lead-free solders
IGBB DHARMA, M Hamdi, T Ariga
Welding Journal 88 (4), 45-48, 2009
32009
Solderability of Sn-Cu-based Lead-free Solder with Low Content of Silver and Indium
IGBB Dharma
Jabatan Kejuruteraan Rekabentuk dan Pembuatan, Fakulti Kejuruteraan …, 2010
2010
Welding, brazing, and Soldering Welding, brazing, and Soldering, 1983
I Dharma, MHA Shukor, T Ariga
Materials transactions 50 (5), 1135-1138, 2009
2009
Soldering Handbook Soldering Handbook, 1999
I Dharma, MHA Shukor, T Ariga
Materials transactions 50 (5), 1135-1138, 2009
2009
T. Nonferr. Metal. Soc. T. Nonferr. Metal. Soc. 16, 1116-1120, 2006
I Dharma, MHA Shukor, T Ariga
Materials transactions 50 (5), 1135-1138, 2009
2009
Brazing of Pure Copper with BAg-8 Braze Alloy
IGBB Dharma
Jabatan Kejuruteraan Rekabentuk dan Pembuatan, Fakulti Kejuruteraan …, 2005
2005
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