Yunhui Mei or Yun-Hui Mei
Yunhui Mei or Yun-Hui Mei
Tianjin Unversity and Tiangong University
Verified email at tju.edu.cn
Title
Cited by
Cited by
Year
Pressureless sintering of nanosilver paste at low temperature to join large area (≥ 100 mm2) power chips for electronic packaging
S Fu, Y Mei, GQ Lu, X Li, G Chen, X Chen
Materials Letters 128, 42-45, 2014
802014
Transient thermal performance of IGBT power modules attached by low-temperature sintered nanosilver
G Chen, D Han, YH Mei, X Cao, T Wang, X Chen, GQ Lu
IEEE Transactions on Device and Materials Reliability 12 (1), 124-132, 2011
632011
Migration of Sintered Nanosilver Die-Attach Material on Alumina Substrate Between 250and 400in Dry Air
Y Mei, GQ Lu, X Chen, S Luo, D Ibitayo
IEEE Transactions on Device and Materials Reliability 11 (2), 316-322, 2010
492010
Simplification of low-temperature sintering nanosilver for power electronics packaging
Y Mei, G Chen, Y Cao, X Li, D Han, X Chen
Journal of electronic materials 42 (6), 1209-1218, 2013
472013
Creep properties of low-temperature sintered nano-silver lap shear joints
X Li, G Chen, L Wang, YH Mei, X Chen, GQ Lu
Materials Science and Engineering: A 579, 108-113, 2013
452013
Study on high temperature bonding reliability of sintered nano-silver joint on bare copper plate
SY Zhao, X Li, YH Mei, GQ Lu
Microelectronics Reliability 55 (12), 2524-2531, 2015
412015
A novel multiscale silver paste for die bonding on bare copper by low-temperature pressure-free sintering in air
J Li, X Li, L Wang, YH Mei, GQ Lu
Materials & Design 140, 64-72, 2018
402018
High-temperature creep behavior of low-temperature-sintered nano-silver paste films
G Chen, XH Sun, P Nie, YH Mei, GQ Lu, X Chen
Journal of electronic materials 41 (4), 782-790, 2012
402012
Effect of joint sizes of low-temperature sintered nano-silver on thermal residual curvature of sandwiched assembly
Y Mei, G Chen, L Guo-Quan, X Chen
International journal of adhesion and adhesives 35, 88-93, 2012
382012
Correlation between interfacial microstructure and bonding strength of sintered nanosilver on ENIG and electroplated Ni/Au direct-bond-copper (DBC) substrates
Q Xu, Y Mei, X Li, GQ Lu
Journal of Alloys and Compounds 675, 317-324, 2016
372016
Rapid sintering nanosilver joint by pulse current for power electronics packaging
Y Mei, Y Cao, G Chen, X Li, GQ Lu, X Chen
IEEE Transactions on Device and Materials Reliability 13 (1), 258-265, 2013
362013
Effect of oxygen partial pressure on silver migration of low-temperature sintered nanosilver die-attach material
Y Mei, GQ Lu, X Chen, S Luo, D Ibitayo
IEEE Transactions on Device and Materials Reliability 11 (2), 312-315, 2010
362010
Pressure-Assisted Low-Temperature Sintering of Nanosilver Paste for 55-Chip Attachment
G Chen, Y Cao, Y Mei, D Han, GQ Lu, X Chen
IEEE Transactions on Components, Packaging and Manufacturing Technology 2 …, 2012
352012
Additive manufacturing of toroid inductor for power electronics applications
Y Yan, J Moss, KDT Ngo, Y Mei, GQ Lu
IEEE Transactions on Industry Applications 53 (6), 5709-5714, 2017
332017
Applying viscoplastic constitutive models to predict ratcheting behavior of sintered nanosilver lap-shear joint
G Chen, ZS Zhang, YH Mei, X Li, DJ Yu, L Wang, X Chen
Mechanics of Materials 72, 61-71, 2014
322014
Mechanical property evaluation of nano‐silver paste sintered joint using lap‐shear test
X Li, G Chen, X Chen, GQ Lu, L Wang, YH Mei
Soldering & surface mount technology, 2012
312012
Investigation of post-etch copper residue on direct bonded copper (DBC) substrates
Y Mei, GQ Lu, X Chen, C Gang, S Luo, D Ibitayo
Journal of electronic materials 40 (10), 2119, 2011
312011
Reliability evaluation of multichip phase-leg IGBT modules using pressureless sintering of nanosilver paste by power cycling tests
S Fu, Y Mei, X Li, C Ma, GQ Lu
IEEE Transactions on Power Electronics 32 (8), 6049-6058, 2016
302016
Parametric Study on Pressureless Sintering of Nanosilver Paste to Bond Large-Area (≥100 mm2) Power Chips at Low Temperatures for Electronic Packaging
S Fu, Y Mei, X Li, P Ning, GQ Lu
Journal of Electronic Materials 44 (10), 3973-3984, 2015
292015
Thermo-mechanical reliability of double-sided IGBT assembly bonded by sintered nanosilver
YH Mei, JY Lian, X Chen, G Chen, X Li, GQ Lu
IEEE Transactions on Device and Materials Reliability 14 (1), 194-202, 2013
282013
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