| Pressureless sintering of nanosilver paste at low temperature to join large area (≥ 100 mm2) power chips for electronic packaging S Fu, Y Mei, GQ Lu, X Li, G Chen, X Chen Materials Letters 128, 42-45, 2014 | 80 | 2014 |
| Transient thermal performance of IGBT power modules attached by low-temperature sintered nanosilver G Chen, D Han, YH Mei, X Cao, T Wang, X Chen, GQ Lu IEEE Transactions on Device and Materials Reliability 12 (1), 124-132, 2011 | 63 | 2011 |
| Migration of Sintered Nanosilver Die-Attach Material on Alumina Substrate Between 250and 400in Dry Air Y Mei, GQ Lu, X Chen, S Luo, D Ibitayo IEEE Transactions on Device and Materials Reliability 11 (2), 316-322, 2010 | 49 | 2010 |
| Simplification of low-temperature sintering nanosilver for power electronics packaging Y Mei, G Chen, Y Cao, X Li, D Han, X Chen Journal of electronic materials 42 (6), 1209-1218, 2013 | 47 | 2013 |
| Creep properties of low-temperature sintered nano-silver lap shear joints X Li, G Chen, L Wang, YH Mei, X Chen, GQ Lu Materials Science and Engineering: A 579, 108-113, 2013 | 45 | 2013 |
| Study on high temperature bonding reliability of sintered nano-silver joint on bare copper plate SY Zhao, X Li, YH Mei, GQ Lu Microelectronics Reliability 55 (12), 2524-2531, 2015 | 41 | 2015 |
| A novel multiscale silver paste for die bonding on bare copper by low-temperature pressure-free sintering in air J Li, X Li, L Wang, YH Mei, GQ Lu Materials & Design 140, 64-72, 2018 | 40 | 2018 |
| High-temperature creep behavior of low-temperature-sintered nano-silver paste films G Chen, XH Sun, P Nie, YH Mei, GQ Lu, X Chen Journal of electronic materials 41 (4), 782-790, 2012 | 40 | 2012 |
| Effect of joint sizes of low-temperature sintered nano-silver on thermal residual curvature of sandwiched assembly Y Mei, G Chen, L Guo-Quan, X Chen International journal of adhesion and adhesives 35, 88-93, 2012 | 38 | 2012 |
| Correlation between interfacial microstructure and bonding strength of sintered nanosilver on ENIG and electroplated Ni/Au direct-bond-copper (DBC) substrates Q Xu, Y Mei, X Li, GQ Lu Journal of Alloys and Compounds 675, 317-324, 2016 | 37 | 2016 |
| Rapid sintering nanosilver joint by pulse current for power electronics packaging Y Mei, Y Cao, G Chen, X Li, GQ Lu, X Chen IEEE Transactions on Device and Materials Reliability 13 (1), 258-265, 2013 | 36 | 2013 |
| Effect of oxygen partial pressure on silver migration of low-temperature sintered nanosilver die-attach material Y Mei, GQ Lu, X Chen, S Luo, D Ibitayo IEEE Transactions on Device and Materials Reliability 11 (2), 312-315, 2010 | 36 | 2010 |
| Pressure-Assisted Low-Temperature Sintering of Nanosilver Paste for 55-Chip Attachment G Chen, Y Cao, Y Mei, D Han, GQ Lu, X Chen IEEE Transactions on Components, Packaging and Manufacturing Technology 2 …, 2012 | 35 | 2012 |
| Additive manufacturing of toroid inductor for power electronics applications Y Yan, J Moss, KDT Ngo, Y Mei, GQ Lu IEEE Transactions on Industry Applications 53 (6), 5709-5714, 2017 | 33 | 2017 |
| Applying viscoplastic constitutive models to predict ratcheting behavior of sintered nanosilver lap-shear joint G Chen, ZS Zhang, YH Mei, X Li, DJ Yu, L Wang, X Chen Mechanics of Materials 72, 61-71, 2014 | 32 | 2014 |
| Mechanical property evaluation of nano‐silver paste sintered joint using lap‐shear test X Li, G Chen, X Chen, GQ Lu, L Wang, YH Mei Soldering & surface mount technology, 2012 | 31 | 2012 |
| Investigation of post-etch copper residue on direct bonded copper (DBC) substrates Y Mei, GQ Lu, X Chen, C Gang, S Luo, D Ibitayo Journal of electronic materials 40 (10), 2119, 2011 | 31 | 2011 |
| Reliability evaluation of multichip phase-leg IGBT modules using pressureless sintering of nanosilver paste by power cycling tests S Fu, Y Mei, X Li, C Ma, GQ Lu IEEE Transactions on Power Electronics 32 (8), 6049-6058, 2016 | 30 | 2016 |
| Parametric Study on Pressureless Sintering of Nanosilver Paste to Bond Large-Area (≥100 mm2) Power Chips at Low Temperatures for Electronic Packaging S Fu, Y Mei, X Li, P Ning, GQ Lu Journal of Electronic Materials 44 (10), 3973-3984, 2015 | 29 | 2015 |
| Thermo-mechanical reliability of double-sided IGBT assembly bonded by sintered nanosilver YH Mei, JY Lian, X Chen, G Chen, X Li, GQ Lu IEEE Transactions on Device and Materials Reliability 14 (1), 194-202, 2013 | 28 | 2013 |
GQ Lu or Guo-Quan Lu or G-Q LuVirginia Tech ECE and MSEVerified email at vt.edu
