Kim S Siow

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Mohd Farhanulhakim Mohd Razip WeeInstitute of Microengineering and Nanoelectronics (IMEN)Verified email at ukm.edu.my
Pei Yuen NgUKM Faculty of PharmacyVerified email at ukm.edu.my
Ebrahim MahmoudiSenior Lecturer, Universiti Kebangsaan Malaysia Department of Chemical and Process EngineeringVerified email at ukm.edu.my
Zuruzi Abu SamahAlfaisal University, Kingdom of Saudi ArabiaVerified email at alfaisal.edu
Yunhui Mei or Yun-Hui MeiTianjin Unversity and Tiangong UniversityVerified email at tju.edu.cn
Dr Ahmad Rifqi Md ZainIMEN, Universiti Kebangsaan Malaysia (UKM)Verified email at ukm.edu.my
Lee Khai ErnProfessor, Universiti Kebangsaan MalaysiaVerified email at ukm.edu.my
GQ Lu or Guo-Quan Lu or G-Q LuVirginia Tech ECE and MSEVerified email at vt.edu
Mohd Ambri MohamedInstitute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan MalaysiaVerified email at ukm.edu.my
Amir ZulkefliStaff Engineer at Infineon Technologies | Reliability EngineeringVerified email at infineon.com
Prof. Abdelkrim KhelifCNRSVerified email at femto-st.fr
Mahmoud AddoucheFEMTO-ST, CNRSVerified email at femto-st.fr
Mazlin Bin MokhtarProfessor of Environmental Chemistry, Universiti Kebangsaan MalaysiaVerified email at ukm.edu.my
gires usupProfessor of Marine Science, Universiti Kebangsaan MalaysiaVerified email at ukm.edu.my
Abdul Wahab Mohammad, FAScProfessor, Chemical Engineering and Desalination, University of SharjahVerified email at sharjah.ac.ae
Xin LiTianjin UniversityVerified email at tju.edu.cn
Azrul Azlan HamzahProfessor of Microelectromechanical Systems (MEMS), IMEN, Universiti Kebangsaan MalaysiaVerified email at ukm.edu.my
Muhamad Ramdzan BuyongInstitute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia (UKM).Verified email at ukm.edu.my
Chwee Teck (C.T.) LimNUSS Professor, Highly Cited Researcher, FNAI FAIMBE FIAMBE FAAET FSAE FSNAS FIUPESM FIESVerified email at nus.edu.sg
Nai Mui HoonBME, NUSVerified email at nus.edu.sg

Kim S Siow

Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia (National

Verified email at ukm.edu.my

sintered silver electronics packaging mechanical behavior of materials plasma treatment


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Plasma methods for the generation of chemically reactive surfaces for biomolecule immobilization and cell colonization‐a review KS Siow, L Britcher, S Kumar, HJ Griesser Plasma processes and polymers 3 (6‐7), 392-418, 2006	1145	2006
Mechanical properties of nano-silver joints as die attach materials KS Siow Journal of Alloys and Compounds 514, 6-19, 2012	425	2012
Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging? KS Siow Journal of Electronic Materials 43 (4), 947-961, 2014	339	2014
Microstructural studies and bonding strength of pressureless sintered nano-silver joints on silver, direct bond copper (DBC) and copper substrates aged at 300° C ST Chua, KS Siow Journal of Alloys and Compounds 687, 486-498, 2016	179	2016
Identifying the development state of sintered silver (Ag) as a bonding material in the microelectronic packaging via a patent landscape study KS Siow, YT Lin Journal of Electronic Packaging 138 (2), 020804, 2016	152	2016
XPS Study of Sulfur and Phosphorus Compounds with Different Oxidation States K SIOW, L Britcher, S Kumar, H JGriesser Sains Malaysiana 47 (8), 1913-1922, 2018	122	2018
Comparing the mechanical and thermal-electrical properties of sintered copper (Cu) and sintered silver (Ag) joints TF Chen, KS Siow Journal of Alloys and Compounds 866, 158783, 2021	118	2021
Mechanical properties of nanocrystalline copper and nickel KS Siow, AAO Tay, P Oruganti Materials science and technology 20 (3), 285-294, 2004	85	2004
Low‐Pressure Plasma Methods for Generating Non‐Reactive Hydrophilic and Hydrogel‐Like Bio‐Interface Coatings–A Review KS Siow, S Kumar, HJ Griesser Plasma Processes and Polymers 12 (1), 8-24, 2015	71	2015
Die-Attach Materials for High Temperature Applications in Microelectronics Packaging KS Siow Materials, Process, Equipment, and Reliability, Springer International …, 2019	65	2019
Sulfonated Surfaces by Sulfur Dioxide Plasma Surface Treatment of Plasma Polymer Films KS Siow, L Britcher, S Kumar, HJ Griesser Plasma Processes and Polymers 6 (9), 583-592, 2009	60	2009
Deposition and XPS and FTIR Analysis of Plasma Polymer Coatings Containing Phosphorus KS Siow, L Britcher, S Kumar, HJ Griesser Plasma Processes and Polymers 11 (2), 133-141, 2014	54	2014
Plasma polymerized carvone as an antibacterial and biocompatible coating YW Chan, KS Siow, PY Ng, U Gires, BY Majlis Materials Science and Engineering: C 68, 861-871, 2016	51	2016
QCM-D and XPS study of protein adsorption on plasma polymers with sulfonate and phosphonate surface groups KS Siow, L Britcher, S Kumar, HJ Griesser Colloids and Surfaces B: Biointerfaces 173, 447-453, 2019	49	2019
Pitting corrosion of duplex stainless steels KS Siow, TY Song, JH Qiu Anti Corrosion Methods and Materials 48 (1), 31-37, 2001	49	2001
Rapid sintering of nano-Ag paste at low current to bond large area (>100 mm²) power chips for electronics packaging Y Xie, Y Wang, Y Mei, H Xie, K Zhang, S Feng, KS Siow, X Li, GQ Lu Journal of Materials Processing Technology 255, 644-649, 2018	43	2018
Electrical conductivity of porous silver made from sintered nanoparticles AS Zuruzi, KS Siow Electronic Materials Letters 11 (2), 308-314, 2015	37	2015
Public benefit and risk perceptions of nanotechnology development: Psychological and sociological aspects NA Kamarulzaman, KE Lee, KS Siow, M Mokhtar Technology in Society 62, 101329, 2020	32	2020
Low Pressure Plasma Modifications for the Generation of Hydrophobic Coatings for Biomaterials Applications KS Siow Plasma Processes and Polymers, https://doi.org/10.1002/ppap.201800059, 2018	30	2018
Thermal Cycling of Sintered Silver (Ag) Joint as Die-Attach Material KS Siow, ST Chua JOM 71 (9), 3066-3075, 2019	29	2019

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