Kim S Siow - Google Scholar

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Zuruzi Abu SamahAlfaisal University, Kingdom of Saudi ArabiaVerified email at alfaisal.edu
Pei Yuen NgUKM Faculty of PharmacyVerified email at ukm.edu.my
Yunhui MeiTianjin UnversityVerified email at tju.edu.cn
Mohd Ambri MohamedInstitute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan MalaysiaVerified email at ukm.edu.my
Amir ZulkefliKyushu University, NIMS Junior Researcher, NIMSVerified email at nims.go.jp
GQ Lu or Guo-Quan Lu or G-Q LuVirginia Tech ECE and MSEVerified email at vt.edu
Jothiramalingam KulothunganIndependent ResearcherVerified email at jaist.ac.jp
Xin LiTianjin UniversityVerified email at tju.edu.cn
Chwee Teck (C.T.) LimNUS Society (NUSS) Professor, Highly Cited Researcher 2019, National University of SingaporeVerified email at nus.edu.sg
Nai Mui HoonBME, NUSVerified email at nus.edu.sg
Prof. Abdelkrim KhelifCNRSVerified email at femto-st.fr
Dr Ahmad Rifqi Md ZainIMEN, Universiti Kebangsaan Malaysia (UKM)Verified email at ukm.edu.my
Azrul Azlan HamzahProfessor of Microelectromechanical Systems (MEMS), IMEN, Universiti Kebangsaan MalaysiaVerified email at ukm.edu.my
Muhamad Ramdzan BuyongUKM, IMENVerified email at ukm.edu.my
Mohd Farhanulhakim Mohd Razip WeeInstitute of Microengineering and Nanoelectronics (IMEN)Verified email at ukm.edu.my
Mahmoud AddoucheFemto-st, CNRSVerified email at femto-st.fr
Mokhtar Awang, M. Awang, Awang, M.Universiti Teknologi PetronasVerified email at utp.edu.my
Bahman MeyghaniInstitute of Materials Joining, School of Materials Science and Engineering, Shandong UniversityVerified email at sdu.edu.cn
Christoph HeinzlUniversity of Applied Sciences Upper AustriaVerified email at fh-wels.at
Bernhard PlankUniversity of Applied Sciences Upper AustriaVerified email at fh-ooe.at

Kim S Siow

Institute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia (National

Verified email at ukm.edu.my

sintering biomaterials plasma modification


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Plasma methods for the generation of chemically reactive surfaces for biomolecule immobilization and cell colonization‐a review KS Siow, L Britcher, S Kumar, HJ Griesser Plasma processes and polymers 3 (6‐7), 392-418, 2006	961	2006
Mechanical properties of nano-silver joints as die attach materials KS Siow Journal of Alloys and Compounds 514, 6-19, 2012	300	2012
Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging? KS Siow Journal of Electronic Materials 43 (4), 947-961, 2014	233	2014
Microstructural studies and bonding strength of pressureless sintered nano-silver joints on silver, direct bond copper (DBC) and copper substrates aged at 300° C ST Chua, KS Siow Journal of Alloys and Compounds 687, 486-498, 2016	89	2016
Identifying the development state of sintered silver (Ag) as a bonding material in the microelectronic packaging via a patent landscape study KS Siow, YT Lin Journal of Electronic Packaging 138 (2), 2016	72	2016
Mechanical properties of nanocrystalline copper and nickel KS Siow, AAO Tay, P Oruganti Materials science and technology 20 (3), 285-294, 2004	72	2004
Low‐Pressure Plasma Methods for Generating Non‐Reactive Hydrophilic and Hydrogel‐Like Bio‐Interface Coatings–A Review KS Siow, S Kumar, HJ Griesser Plasma Processes and Polymers 12 (1), 8-24, 2015	48	2015
Sulfonated Surfaces by Sulfur Dioxide Plasma Surface Treatment of Plasma Polymer Films KS Siow, L Britcher, S Kumar, HJ Griesser Plasma Processes and Polymers 6 (9), 583-592, 2009	41	2009
Pitting corrosion of duplex stainless steels KS Siow, TY Song, JH Qiu Anti Corrosion Methods and Materials 48 (1), 31-37, 2001	37	2001
Electrical conductivity of porous silver made from sintered nanoparticles AS Zuruzi, KS Siow Electronic Materials Letters 11 (2), 308-314, 2015	28	2015
Mixed mode fracture toughness of lead–tin and tin–silver solder joints with nickel-plated substrate KS Siow, M Manoharan Materials Science and Engineering: A 404 (1-2), 244-250, 2005	26	2005
Deposition and XPS and FTIR Analysis of Plasma Polymer Coatings Containing Phosphorus KS Siow, L Britcher, S Kumar, HJ Griesser Plasma Processes and Polymers 11 (2), 133-141, 2014	25	2014
Plasma polymerized carvone as an antibacterial and biocompatible coating YW Chan, KS Siow, PY Ng, U Gires, BY Majlis Materials Science and Engineering: C 68, 861-871, 2016	19	2016
Rapid sintering of nano-Ag paste at low current to bond large area (>100 mm²) power chips for electronics packaging Y Xie, Y Wang, Y Mei, H Xie, K Zhang, S Feng, KS Siow, X Li, GQ Lu Journal of Materials Processing Technology 255, 644-649, 2018	16	2018
Correlation between intermetallic thickness and roughness during solder reflow AS Zuruzi, SK Lahiri, P Burman, KS Siow Journal of electronic materials 30 (8), 997-1000, 2001	15	2001
Die-Attach Materials for High Temperature Applications in Microelectronics Packaging KS Siow Materials, Process, Equipment, and Reliability, Springer International …, 2019	13	2019
Enhancing the biocompatibility of the polyurethane methacrylate and off-stoichiometry thiol-ene polymers by argon and nitrogen plasma treatment TF Chen, KS Siow, PY Ng, BY Majlis Materials Science and Engineering: C 79, 613-621, 2017	13	2017
QCM-D and XPS study of protein adsorption on plasma polymers with sulfonate and phosphonate surface groups KS Siow, L Britcher, S Kumar, HJ Griesser Colloids and Surfaces B: Biointerfaces 173, 447-453, 2019	12	2019
Ageing properties of polyurethane methacrylate and off‐stoichiometry thiol‐ene polymers after nitrogen and argon plasma treatment TF Chen, KS Siow, PY Ng, MH Nai, CT Lim, B Yeop Majlis Journal of Applied Polymer Science 133 (42), 2016	12	2016
XPS Study of Sulfur and Phosphorus Compounds with Different Oxidation States K SIOW, L Britcher, S Kumar, H JGriesser Sains Malaysiana 47 (8), 1913-1922, 2018	10	2018

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