Kim S Siow

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Pei Yuen NgUKM Faculty of PharmacyVerified email at ukm.edu.my
Zuruzi Abu SamahAlfaisal University, Kingdom of Saudi ArabiaVerified email at alfaisal.edu
Yunhui Mei or Yun-Hui MeiTianjin Unversity and Tiangong UniversityVerified email at tju.edu.cn
Mohd Ambri MohamedInstitute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan MalaysiaVerified email at ukm.edu.my
Amir ZulkefliKyushu University, NIMS Junior Researcher, NIMSVerified email at nims.go.jp
Mohd Farhanulhakim Mohd Razip WeeInstitute of Microengineering and Nanoelectronics (IMEN)Verified email at ukm.edu.my
GQ Lu or Guo-Quan Lu or G-Q LuVirginia Tech ECE and MSEVerified email at vt.edu
Lee Khai ErnAssociate Professor, Universiti Kebangsaan MalaysiaVerified email at ukm.edu.my
Prof. Abdelkrim KhelifCNRSVerified email at femto-st.fr
Dr Ahmad Rifqi Md ZainIMEN, Universiti Kebangsaan Malaysia (UKM)Verified email at ukm.edu.my
Azrul Azlan HamzahProfessor of Microelectromechanical Systems (MEMS), IMEN, Universiti Kebangsaan MalaysiaVerified email at ukm.edu.my
Muhamad Ramdzan BuyongIMEN, UKM. Microfluidics/Lab-on-chip/DielectrophoresisVerified email at ukm.edu.my
Xin LiTianjin UniversityVerified email at tju.edu.cn
Mazlin MokhtarProfessor of Environmental Chemistry, Universiti Kebangsaan MalaysiaVerified email at ukm.edu.my
Chwee Teck (C.T.) LimNUS Society (NUSS) Professor, FNAI. FAIMBE, FIAMBE, FSAE, FSNAS, National University of SingaporeVerified email at nus.edu.sg
Nai Mui HoonBME, NUSVerified email at nus.edu.sg
Mahmoud AddoucheFemto-st, CNRSVerified email at femto-st.fr
Mokhtar Awang, M. Awang, Awang, M.Universiti Teknologi PetronasVerified email at utp.edu.my
Bahman MeyghaniInstitute of Materials Joining, School of Materials Science and Engineering, Shandong UniversityVerified email at sdu.edu.cn
Christoph HeinzlHead of Research Center, University of Applied Sciences Upper AustriaVerified email at fh-wels.at

Kim S Siow

Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia (National

Verified email at ukm.edu.my

sintered silver electronics packaging mechanical behavior of materials plasma treatment


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Plasma methods for the generation of chemically reactive surfaces for biomolecule immobilization and cell colonization‐a review KS Siow, L Britcher, S Kumar, HJ Griesser Plasma processes and polymers 3 (6‐7), 392-418, 2006	1008	2006
Mechanical properties of nano-silver joints as die attach materials KS Siow Journal of Alloys and Compounds 514, 6-19, 2012	330	2012
Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging? KS Siow Journal of Electronic Materials 43 (4), 947-961, 2014	259	2014
Microstructural studies and bonding strength of pressureless sintered nano-silver joints on silver, direct bond copper (DBC) and copper substrates aged at 300° C ST Chua, KS Siow Journal of Alloys and Compounds 687, 486-498, 2016	106	2016
Identifying the development state of sintered silver (Ag) as a bonding material in the microelectronic packaging via a patent landscape study KS Siow, YT Lin Journal of Electronic Packaging 138 (2), 2016	94	2016
Mechanical properties of nanocrystalline copper and nickel KS Siow, AAO Tay, P Oruganti Materials science and technology 20 (3), 285-294, 2004	76	2004
Low‐Pressure Plasma Methods for Generating Non‐Reactive Hydrophilic and Hydrogel‐Like Bio‐Interface Coatings–A Review KS Siow, S Kumar, HJ Griesser Plasma Processes and Polymers 12 (1), 8-24, 2015	55	2015
Sulfonated Surfaces by Sulfur Dioxide Plasma Surface Treatment of Plasma Polymer Films KS Siow, L Britcher, S Kumar, HJ Griesser Plasma Processes and Polymers 6 (9), 583-592, 2009	42	2009
Pitting corrosion of duplex stainless steels KS Siow, TY Song, JH Qiu Anti Corrosion Methods and Materials 48 (1), 31-37, 2001	39	2001
Deposition and XPS and FTIR Analysis of Plasma Polymer Coatings Containing Phosphorus KS Siow, L Britcher, S Kumar, HJ Griesser Plasma Processes and Polymers 11 (2), 133-141, 2014	34	2014
Electrical conductivity of porous silver made from sintered nanoparticles AS Zuruzi, KS Siow Electronic Materials Letters 11 (2), 308-314, 2015	32	2015
XPS Study of Sulfur and Phosphorus Compounds with Different Oxidation States K SIOW, L Britcher, S Kumar, H JGriesser Sains Malaysiana 47 (8), 1913-1922, 2018	29	2018
Mixed mode fracture toughness of lead–tin and tin–silver solder joints with nickel-plated substrate KS Siow, M Manoharan Materials Science and Engineering: A 404 (1-2), 244-250, 2005	26	2005
Die-Attach Materials for High Temperature Applications in Microelectronics Packaging KS Siow Materials, Process, Equipment, and Reliability, Springer International …, 2019	22	2019
Plasma polymerized carvone as an antibacterial and biocompatible coating YW Chan, KS Siow, PY Ng, U Gires, BY Majlis Materials Science and Engineering: C 68, 861-871, 2016	21	2016
Rapid sintering of nano-Ag paste at low current to bond large area (>100 mm²) power chips for electronics packaging Y Xie, Y Wang, Y Mei, H Xie, K Zhang, S Feng, KS Siow, X Li, GQ Lu Journal of Materials Processing Technology 255, 644-649, 2018	20	2018
Enhancing the biocompatibility of the polyurethane methacrylate and off-stoichiometry thiol-ene polymers by argon and nitrogen plasma treatment TF Chen, KS Siow, PY Ng, BY Majlis Materials Science and Engineering: C 79, 613-621, 2017	17	2017
QCM-D and XPS study of protein adsorption on plasma polymers with sulfonate and phosphonate surface groups KS Siow, L Britcher, S Kumar, HJ Griesser Colloids and Surfaces B: Biointerfaces 173, 447-453, 2019	16	2019
Ageing properties of polyurethane methacrylate and off‐stoichiometry thiol‐ene polymers after nitrogen and argon plasma treatment TF Chen, KS Siow, PY Ng, MH Nai, CT Lim, B Yeop Majlis Journal of Applied Polymer Science 133 (42), 2016	15	2016
Correlation between intermetallic thickness and roughness during solder reflow AS Zuruzi, SK Lahiri, P Burman, KS Siow Journal of electronic materials 30 (8), 997-1000, 2001	15	2001

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