Kim S Siow
Kim S Siow
Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia (National
Verified email at ukm.edu.my
Title
Cited by
Cited by
Year
Plasma methods for the generation of chemically reactive surfaces for biomolecule immobilization and cell colonization‐a review
KS Siow, L Britcher, S Kumar, HJ Griesser
Plasma processes and polymers 3 (6‐7), 392-418, 2006
10082006
Mechanical properties of nano-silver joints as die attach materials
KS Siow
Journal of Alloys and Compounds 514, 6-19, 2012
3302012
Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?
KS Siow
Journal of Electronic Materials 43 (4), 947-961, 2014
2592014
Microstructural studies and bonding strength of pressureless sintered nano-silver joints on silver, direct bond copper (DBC) and copper substrates aged at 300° C
ST Chua, KS Siow
Journal of Alloys and Compounds 687, 486-498, 2016
1062016
Identifying the development state of sintered silver (Ag) as a bonding material in the microelectronic packaging via a patent landscape study
KS Siow, YT Lin
Journal of Electronic Packaging 138 (2), 2016
942016
Mechanical properties of nanocrystalline copper and nickel
KS Siow, AAO Tay, P Oruganti
Materials science and technology 20 (3), 285-294, 2004
762004
Low‐Pressure Plasma Methods for Generating Non‐Reactive Hydrophilic and Hydrogel‐Like Bio‐Interface Coatings–A Review
KS Siow, S Kumar, HJ Griesser
Plasma Processes and Polymers 12 (1), 8-24, 2015
552015
Sulfonated Surfaces by Sulfur Dioxide Plasma Surface Treatment of Plasma Polymer Films
KS Siow, L Britcher, S Kumar, HJ Griesser
Plasma Processes and Polymers 6 (9), 583-592, 2009
422009
Pitting corrosion of duplex stainless steels
KS Siow, TY Song, JH Qiu
Anti Corrosion Methods and Materials 48 (1), 31-37, 2001
392001
Deposition and XPS and FTIR Analysis of Plasma Polymer Coatings Containing Phosphorus
KS Siow, L Britcher, S Kumar, HJ Griesser
Plasma Processes and Polymers 11 (2), 133-141, 2014
342014
Electrical conductivity of porous silver made from sintered nanoparticles
AS Zuruzi, KS Siow
Electronic Materials Letters 11 (2), 308-314, 2015
322015
XPS Study of Sulfur and Phosphorus Compounds with Different Oxidation States
K SIOW, L Britcher, S Kumar, H JGriesser
Sains Malaysiana 47 (8), 1913-1922, 2018
292018
Mixed mode fracture toughness of lead–tin and tin–silver solder joints with nickel-plated substrate
KS Siow, M Manoharan
Materials Science and Engineering: A 404 (1-2), 244-250, 2005
262005
Die-Attach Materials for High Temperature Applications in Microelectronics Packaging
KS Siow
Materials, Process, Equipment, and Reliability, Springer International …, 2019
222019
Plasma polymerized carvone as an antibacterial and biocompatible coating
YW Chan, KS Siow, PY Ng, U Gires, BY Majlis
Materials Science and Engineering: C 68, 861-871, 2016
212016
Rapid sintering of nano-Ag paste at low current to bond large area (>100 mm2) power chips for electronics packaging
Y Xie, Y Wang, Y Mei, H Xie, K Zhang, S Feng, KS Siow, X Li, GQ Lu
Journal of Materials Processing Technology 255, 644-649, 2018
202018
Enhancing the biocompatibility of the polyurethane methacrylate and off-stoichiometry thiol-ene polymers by argon and nitrogen plasma treatment
TF Chen, KS Siow, PY Ng, BY Majlis
Materials Science and Engineering: C 79, 613-621, 2017
172017
QCM-D and XPS study of protein adsorption on plasma polymers with sulfonate and phosphonate surface groups
KS Siow, L Britcher, S Kumar, HJ Griesser
Colloids and Surfaces B: Biointerfaces 173, 447-453, 2019
162019
Ageing properties of polyurethane methacrylate and off‐stoichiometry thiol‐ene polymers after nitrogen and argon plasma treatment
TF Chen, KS Siow, PY Ng, MH Nai, CT Lim, B Yeop Majlis
Journal of Applied Polymer Science 133 (42), 2016
152016
Correlation between intermetallic thickness and roughness during solder reflow
AS Zuruzi, SK Lahiri, P Burman, KS Siow
Journal of electronic materials 30 (8), 997-1000, 2001
152001
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Articles 1–20