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- Liancheng WangCollege of Mechanical and Electrical Engineering, Central South University, Changsha Hunan, ChinaVerified email at semi.ac.cn
- Hongwei ZhuTsinghua UniversityVerified email at tsinghua.edu.cn
- Manijeh RazeghiNorthwestern UniversityVerified email at eecs.northwestern.edu
- Arash DehzangiAssistant Professor at Northwestern UniversityVerified email at northwestern.edu
- Hongjian LiSolid State Lighting & Energy Electronics Center, UCSBVerified email at ucsb.edu
- Panpan LiUniversity of California, Santa BarbaraVerified email at ucsb.edu
- Hoi Wai ChoiProfessor, Electrical and Electronic Engineering, The University of Hong KongVerified email at hku.hk
- Abbas HaddadiResearch Assistant Professor at Northwestern UniversityVerified email at u.northwestern.edu
- Romain ChevallierNorthwestern UniversityVerified email at u.northwestern.edu
- Lining LiuInstitute of Semiconductors, Chinese Academy of SciencesVerified email at semi.ac.cn
- Zi-Hui ZhangProfessor, Hebei University of TechnologyVerified email at hebut.edu.cn
- liu zhiqiangInstitute of Semiconductors, Chinese Academy of SciencesVerified email at semi.ac.cn
- Jianlong XuInstitute of Functional Nano & Soft Materials, Soochow UniversityVerified email at suda.edu.cn
- Jian-An HuangAssistant Professor, Academy Research Fellow, and Group Leader, University of OuluVerified email at oulu.fi
- Donghai WuInstitute of Semiconductor, CASVerified email at semi.ac.cn
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Yiyun Zhang
Institute of Semiconcutors, Chinese Academy of Sciences
Verified email at semi.ac.cn