Mohd Arif Anuar Mohd Salleh
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Rapid Cu6Sn5 growth at liquid Sn/solid Cu interfaces
MAAM Salleh, SD McDonald, H Yasuda, A Sugiyama, K Nogita
Scripta Materialia 100, 17-20, 2015
Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process
MAAM Salleh, SD McDonald, CM Gourlay, SA Belyakov, H Yasuda, ...
Journal of Electronic Materials 45 (1), 154-163, 2016
Suppression of Cu6Sn5 in TiO2 reinforced solder joints after multiple reflow cycles
MAAM Salleh, SD McDonald, CM Gourlay, H Yasuda, K Nogita
Materials & Design 108, 418-428, 2016
Effect of TiO2 additions on Sn-0.7 Cu-0.05 Ni lead-free composite solder
MII Ramli, N Saud, MAAM Salleh, MN Derman, RM Said
Microelectronics Reliability 65, 255-264, 2016
Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0. 7Cu solders on Cu substrates
MAAM Salleh, SD McDonald, K Nogita
Journal of Materials Processing Technology 242, 235-245, 2017
MH Zan@ Hazizi, F
M Salleh, MA Abdullah
Somidin, NFM Alui, and Z. A. Ahmad: Materials Science and Engineering 556 …, 2012
In situ imaging of microstructure formation in electronic interconnections
MAAM Salleh, CM Gourlay, JW Xian, SA Belyakov, H Yasuda, ...
Scientific reports 7 (1), 1-11, 2017
Development of a microwave sintered TiO2 reinforced Sn–0.7 wt% Cu–0.05 wt% Ni alloy
MAAM Salleh, SD McDonald, Y Terada, H Yasuda, K Nogita
Materials & Design 82, 136-147, 2015
Mechanical properties of Sn–0.7 Cu/Si3N4 lead-free composite solder
MAAM Salleh, AMM Al Bakri, MH Zan, F Somidin, NFM Alui, ZA Ahmad
Materials Science and Engineering: A 556, 633-637, 2012
The influence of ageing on the stabilisation of interfacial (Cu, Ni) 6 (Sn, Zn) 5 and (Cu, Au, Ni) 6Sn5 intermetallics in Pb-free Ball Grid Array (BGA) solder joints
G Zeng, SD McDonald, D Mu, Y Terada, H Yasuda, Q Gu, MAAM Salleh, ...
Journal of Alloys and Compounds 685, 471-482, 2016
Strength of concrete based cement using recycle ceramic waste as aggregate
AM Al Bakri, MN Norazian, H Kamarudin, MAA Mohd Salleh, A Alida
Advanced Materials Research 740, 734-738, 2013
Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review
MAA Mohd Salleh, S McDonald, K Nogita
Applied Mechanics and Materials 421, 260-266, 2013
Zn-Sn based high temperature solder-A short review
SA Musa, MAA Mohd Salleh, S Norainiza
Advanced Materials Research 795, 518-521, 2013
Wettability, electrical and mechanical properties of 99.3 Sn-0.7 Cu/Si3N4 novel lead-free nanocomposite solder
MAA Mohd Salleh, MH Hazizi, ZA Ahmad, K Hussin, KR Ahmad
Advanced Materials Research 277, 106-111, 2011
MH Zan@ Hazizi, and F
MAAM Salleh, AMM Al Bakri, H Kamarudin, M Bnhussain
Somidin, Phys. Procedia 22, 299, 2011
Intermetallic compound formation on solder alloy/Cu-substrate interface using lead-free Sn-0.7 Cu/recycled-Aluminum composite solder
F Somidin, MAA Mohd Salleh, RA Khairel
Advanced Materials Research 620, 105-111, 2013
Characterising the polymorphic phase transformation at a localised point on a Cu6Sn5 grain
F Somidin, H Maeno, MAAM Salleh, XQ Tran, SD McDonald, ...
Materials Characterization 138, 113-119, 2018
In Situ TEM Observations of Cu6Sn5 Polymorphic Transformations in Reaction Layers Between Sn-0.7Cu Solders and Cu Substrates
K Nogita, MAAM Salleh, E Tanaka, G Zeng, SD McDonald, S Matsumura
Jom 68 (11), 2871-2878, 2016
A comparative study of solder properties of Sn-0.7 Cu lead-free solder fabricated via the powder metallurgy and casting methods
M Salleh, AMM Al Bakri, F Somidin, AV Sandu, N Saud, H Kamaruddin, ...
Revista de Chimie (Bucharest) 64 (7), 2013
H Kamarudin, Bnhussain M, Zan@ Hazizi MH, Somidin F. Solderability of Sn-0.7 Cu/Si3N4 lead-free composite solder on Cu-substrate
MAA Mohd Salleh, AM Mustafa Al Bakri
Physics Procedia 22, 299-304, 2011
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