| The origin of phase separation in silicate melts and glasses V McGahay, M Tomozawa Journal of non-crystalline solids 109 (1), 27-34, 1989 | 80 | 1989 |
| Hardmask for reliability of silicon based dielectrics S Van Nguyen, M Lane, SM Gates, XH Liu, VJ McGahay, SC Mehta, ... US Patent 7,335,980, 2008 | 73 | 2008 |
| Phase separation in rare-earth-doped SiO2 glasses V McGahay, M Tomozawa Journal of non-crystalline solids 159 (3), 246-252, 1993 | 73 | 1993 |
| High performance 65 nm SOI technology with enhanced transistor strain and advanced-low-K BEOL WH Lee, A Waite, H Nii, HM Nayfeh, V McGahay, H Nakayama, D Fried, ... IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest., 4 …, 2005 | 69 | 2005 |
| A high performance 0.13/spl mu/m copper BEOL technology with low-k dielectric RD Goldblatt, B Agarwala, MB Anand, EP Barth, GA Biery, ZG Chen, ... Proceedings of the IEEE 2000 International Interconnect Technology …, 2000 | 69 | 2000 |
| Multi-functional structure for enhanced chip manufacturibility and reliability for low k dielectrics semiconductors and a crackstop integrity screen and monitor WF Landers, TM Shaw, D Llera-Hurlburt, SW Crowder, VJ McGahay, ... US Patent 7,098,676, 2006 | 67 | 2006 |
| Reliable BEOL integration process with direct CMP of porous SiCOH dielectric CD Dimitrakopoulos, SM Gates, VJ McGahay, SC Mehta US Patent 7,253,105, 2007 | 65 | 2007 |
| Stacked via-stud with improved reliability in copper metallurgy BN Agarwala, CA Barile, HM Dalal, BH Engle, M Lane, E Levine, XH Liu, ... US Patent 6,972,209, 2005 | 65 | 2005 |
| Carbon-free hydrogen silsesquioxane with dielectric constant less than 3.2 annealed in hydrogen for integrated circuits SA Cohen, VJ McGahay, RR Uttecht US Patent 5,530,293, 1996 | 65 | 1996 |
| Crackstop and oxygen barrier for low-K dielectric integrated circuits HA Nye III, VJ McGahay, KA Tallman US Patent 6,261,945, 2001 | 56 | 2001 |
| Porous dielectrics in microelectronic wiring applications V McGahay Materials 3 (1), 536-562, 2010 | 55 | 2010 |
| Robust interconnect structure DC Edelstein, V McGahay, HA Nye III, BGR Ottey, WH Price US Patent 6,133,136, 2000 | 53 | 2000 |
| Integrated circuit having resistor between BEOL interconnect and FEOL structure and related method AK Chinthakindi, VJ McGahay US Patent 8,013,394, 2011 | 51 | 2011 |
| Damascene etchback for low ε dielectric AK Stamper, VJ McGahay US Patent 6,331,481, 2001 | 50 | 2001 |
| Device and methodology for reducing effective dielectric constant in semiconductor devices DC Edelstein, ME Colburn, EC Cooney III, TJ Dalton, JA Fitzsimmons, ... US Patent 7,892,940, 2011 | 49 | 2011 |
| Hardmask for improved reliability of silicon based dielectrics S Van Nguyen, M Lane, SM Gates, XH Liu, VJ McGahay, SC Mehta, ... US Patent 7,485,582, 2009 | 45 | 2009 |
| Device and methodology for reducing effective dielectric constant in semiconductor devices DC Edelstein, ME Colburn, EC Cooney III, TJ Dalton, JA Fitzsimmons, ... US Patent 7,405,147, 2008 | 43* | 2008 |
| Building metal pillars in a chip for structure support H Hichri, XH Liu, VJ McGahay, CE Murray, JP Nayak, TM Shaw US Patent 7,067,902, 2006 | 40 | 2006 |
| Deep trench crackstops under contacts MS Angyal, LA Clevenger, VJ McGahay, SV Nitta, S Yao US Patent 8,237,246, 2012 | 39 | 2012 |
| Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof E Barth, JA Fitzsimmons, SM Gates, TH Ivers, SL Lane, J Lee, ... US Patent 6,737,747, 2004 | 37 | 2004 |
