GQ Lu or Guo-Quan Lu or G-Q Lu

Cited by

	All	Since 2016
Citations	7549	3389
h-index	43	28
i10-index	167	111

760

380

190

570

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Co-authors

Xu ChenTianjin UniversityVerified email at tju.edu.cn
Khai NgoProfessor of Electrical and Computer Engineering, Virginia TechVerified email at vt.edu
Xin LiTianjin UniversityVerified email at tju.edu.cn
Dushan BoroyevichVirginia TechVerified email at vt.edu
Gang ChenSchool of Chemical Engineering and Technology, Tianjin UniversityVerified email at tju.edu.cn
Michael AzizGene and Tracy Sykes Professor of Materials and Energy Technologies, Harvard School of EngineeringVerified email at harvard.edu
Xiao CaoElectrical and computing engineering, Virginia TechVerified email at vt.edu
Rolando BurgosProfessor at Virginia Tech, Center for Power Electronics Systems (CPES)Verified email at vt.edu
Dunji YuOak Ridge National LaboratoryVerified email at ornl.gov
Zheng ChenDanfoss Silicon PowerVerified email at danfoss.com
David A. DillardAdhesive and Sealant Science Professor of Biomedical Engineering and Mechanics, Virginia TechVerified email at vt.edu
Fei (Fred) WangUniversity of Tennessee, KnoxvilleVerified email at utk.edu

GQ Lu or Guo-Quan Lu or G-Q Lu

Virginia Tech ECE and MSE

Verified email at vt.edu

Power Electronics Packaging and Integration Device Interconnect & Insulation Magnetic Materials & Additive Manufacturing Nano


Title Sort by citations Sort by year Sort by title	Cited by Cited by	Year
Low-temperature sintered nanoscale silver as a novel semiconductor device-metallized substrate interconnect material JG Bai, ZZ Zhang, JN Calata, GQ Lu IEEE Transactions on components and packaging technologies 29 (3), 589-593, 2006	334	2006
Low-temperature sintering with nano-silver paste in die-attached interconnection T Wang, X Chen, GQ Lu, GY Lei journal of electronic materials 36 (10), 1333-1340, 2007	310	2007
Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area Chips TG Lei, JN Calata, GQ Lu, X Chen, S Luo IEEE Transactions on Components and Packaging Technologies 33 (1), 98-104, 2009	226	2009
Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow Z Zhang, GQ Lu IEEE Transactions on electronics packaging manufacturing 25 (4), 279-283, 2002	213	2002
Thermomechanical reliability of low-temperature sintered silver die attached SiC power device assembly JG Bai, GQ Lu IEEE Transactions on device and materials reliability 6 (3), 436-441, 2006	205	2006
The activation strain tensor: nonhydrostatic stress effects on crystal-growth kinetics MJ Aziz, PC Sabin, GQ Lu Physical Review B 44 (18), 9812, 1991	194	1991
Pressure‐enhanced crystallization kinetics of amorphous Si and Ge: Implications for point‐defect mechanisms GQ Lu, E Nygren, MJ Aziz Journal of applied physics 70 (10), 5323-5345, 1991	192	1991
High-temperature operation of SiC power devices by low-temperature sintered silver die-attachment JG Bai, J Yin, Z Zhang, GQ Lu, JD van Wyk IEEE transactions on advanced packaging 30 (3), 506-510, 2007	154	2007
Processing and characterization of nanosilver pastes for die-attaching SiC devices JG Bai, JN Calata, GQ Lu IEEE Transactions on electronics packaging manufacturing 30 (4), 241-245, 2007	138	2007
Technology trends toward a system-in-a-module in power electronics FC Lee, JD van Wyk, D Boroyevich, GQ Lu, Z Liang, P Barbosa IEEE Circuits and systems magazine 2 (4), 4-22, 2002	118	2002
Applying Anand model to low-temperature sintered nanoscale silver paste chip attachment D Yu, X Chen, G Chen, G Lu, Z Wang Materials & Design 30 (10), 4574-4579, 2009	108	2009
Circumferential-mode, quasi-ring-type, magnetoelectric laminate composite—a highly sensitive electric current and∕ or vortex magnetic field sensor S Dong, JG Bai, J Zhai, JF Li, GQ Lu, D Viehland, S Zhang, TR Shrout Applied Physics Letters 86 (18), 182506, 2005	105	2005
Three-dimensional packaging for power semiconductor devices and modules JN Calata, JG Bai, X Liu, S Wen, GQ Lu IEEE transactions on advanced packaging 28 (3), 404-412, 2005	103	2005
Characterization of lead-free solder and sintered nano-silver die-attach layers using thermal impedance X Cao, T Wang, KDT Ngo, GQ Lu IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (4 …, 2011	102	2011
A novel high-temperature planar package for SiC multichip phase-leg power module P Ning, TG Lei, F Wang, GQ Lu, KDT Ngo, K Rajashekara IEEE Transactions on power Electronics 25 (8), 2059-2067, 2010	99	2010
An innovative technique for packaging power electronic building blocks using metal posts interconnected parallel plate structures S Haque, K Xing, RL Lin, CTA Suchicital, GQ Lu, DJ Nelson, D Borojevic, ... IEEE Transactions on Advanced Packaging 22 (2), 136-144, 1999	95	1999
A lead-free, low-temperature sintering die-attach technique for high-performance and high-temperature packaging GQ Lu, JN Calata, Z Zhang, JG Bai Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem …, 2004	94	2004
Effect of mismatched sintering kinetics on camber in a low‐temperature cofired ceramic package GQ Lu, RC Sutterlin, TK Gupta Journal of the American Ceramic Society 76 (8), 1907-1914, 1993	94	1993
In vitro photothermal study of gold nanoshells functionalized with small targeting peptides to liver cancer cells SY Liu, ZS Liang, F Gao, SF Luo, GQ Lu Journal of Materials Science: Materials in Medicine 21 (2), 665-674, 2010	86	2010
Effects of solder joint shape and height on thermal fatigue lifetime X Liu, GQ Lu IEEE transactions on components and packaging technologies 26 (2), 455-465, 2003	86	2003

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